Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing touch panel

A photosensitive resin composition which contains a binder polymer (component (A)), a photopolymerizable compound (component (B)) and a photopolymerization initiator (component (C)), and wherein: the component (B) contains a (meth)acrylate having six ethylenically unsaturated bonds in each molecule and a (meth)acrylate having one ethylenically unsaturated bond in each molecule; and the content of the (meth)acrylate having one ethylenically unsaturated bond in each molecule is 10 parts by mass or less per 100 parts by mass of the total of the component (A) and the component (B).