Advanced Cryogenic Aerosol Cleaning: Small Particle Removal and Damage-Free Performance

The performance of a new cryogenic aerosol process was evaluated for cleaning nanoparticles and providing damage-free processing. Particle Removal Efficiency (PRE) tests conducted with wet deposited 40 nm, 30 nm and 18 nm silica particles on 300 mm wafers demonstrated cleaning efficiencies above 80%. Damage-free capability of the cryogenic aerosol process was evaluated with poly-silicon lines with an aspect ratio of approximately 9:1. These results highlight the potential of this new cryogenic aerosol to provide semiconductor device yield benefits by reducing small particulate contamination without causing pattern damage.