EMC analysis on stacked packages

In this paper, EMC analysis on stacked packages using different simulation methods is presented. A large part of the EMC control is the understanding of different resonances emerging in the package. At the resonances frequencies, both the internal noise sources inside the package and the external noise sources outside the package are generating strong fields and voltages, and the package is most vulnerable for EMC problems causing malfunction. As the level of integration in mobile devices continues to grow, the control of EMC/EMI performance in electronic packages becomes more and more challenging. With well-defined EMC verification simulations, the designs can be improved and many of the potential problems can be avoided before the manufacturing. After the resonance analysis, interconnect bondwire simulation results using RLC equivalent circuit models are presented. At the end, the validation of simulation results is discussed.