Surface treating agent for no-outline electrolytic copper foils

The invention belongs to the technical field of electrolytic copper foil processing, and particularly relates to a surface treating agent for no-outline electrolytic copper foils. Every liter of surface treating agent water solution contains 0.5-2.0g of N-(beta-aminoethyl)-gamma-aminopropyltrimethoxysilane, 0.5-2.0g of N- vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride and 0.1-0.4g of ethyl silicate. The surface treating agent has the advantages of simple components and accessible raw materials, and is convenient to use. When being sprayed on the surface of the no-outline copper foil, the surface treating agent can obviously enhance the peel strength of the no-outline copper foil on a high-frequency microwave circuit board, so that the peel strength of the no-outline copper foil on a polyamide resin or polytetrafluoroethylene substrate is greater than or equal to 0.6 N/mm.