16 16 VCSEL Array Flip-Chip Bonded to CMOS

We report the flip-chip bonding of a 16 16 array of 970-nm vertical-cavity surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circuits. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz. Individual VC- SELs are capable of being modulated by the CMOS circuits at 1 Gb/s. The thermal impedance of the flip-chip bonded VCSELs is 1 C/mW. The measured crosstalk suppression between channels is approximately 20 dB. Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated. Index Terms—CMOS integrated circuits, flip-chip bonding, lasers, optical arrays, quantum well devices, smart pixels, ver- tical-cavity surface-emitting lasers (VCSELs).