Monitoring glass transition of epoxy encapsulant using thermal analysis techniques

Glass transition temperature, better known by the acronym T/sub g/ in the electronic industry, is a frequently used parameter to depict the degree of cure of epoxy encapsulant. T/sub g/ can be measured by a variety of thermal analysis techniques and often vary as the optimised conditions differ between the different techniques. This paper investigates and reports the glass transition temperature range of a cured epoxy encapsulant using differential scanning calorimetry, thermomechanical analysis and dynamic mechanical analysis.