Microstructure and properties of the novel Cu–0.30Mg–0.05Ce alloy processed by equal channel angular pressing

Abstract A novel Cu–0.30Mg–0.05Ce (wt%) alloy was designed and prepared by melting and casting. The hot-rolled Cu–Mg–Ce alloy with an average grain size of 24.3 μm was processed by equal channel angular pressing (ECAP) via route B C with different passes at room temperature. Moreover, microstructure evolution, mechanical properties and electrical conductivity of the alloy subjected to ECAP with different passes have been analyzed. The transmission electron microscope observation and electron backscatter diffraction analysis results show that the grains were refined significantly and the low angle boundaries generated at the initial stage of deformation were gradually transformed to the high angle boundaries with increasing the number of ECAP passes. After 8 ECAP passes, the average grain size decreased to 1.2 μm, and the fraction of high angle boundaries was 87.7%. Besides, the typical FCC shear textures ({111} , {111} and {001} ) were generated during ECAP deformation. Furthermore, tension testing results indicated that the tensile strength was remarkably improved from ∼274 MPa before ECAP to ∼588 MPa after 8 ECAP passes, maintaining an appropriate elongation of ∼11% and good electrical conductivity of 73.5% International Annealed Copper Standard (IACS), which showed bright prospect in high-speed railway as a contact wire material.