Resin composition for encapsulating semiconductor, and method for encapsulating semiconductor using the resin composition

PROBLEM TO BE SOLVED: To provide a resin composition for encapsulating a semiconductor low in a viscosity and having fluidity at room temperature, high in a glass transition point, and capable of suppressing a warpage of a resin-encapsulating molded article, and a method for encapsulating a semiconductor reduced in a warpage even after resin-encapsulating molding, specifically a method for encapsulating a wafer level package.SOLUTION: The resin composition for encapsulating a semiconductor includes: 3, 4, 3', 4'-diepoxy bicyclohexyl (A) which is an alicyclic epoxy compound constituted by singly bonding two cyclohexene oxide groups; an epoxy resin (B) which is liquid at room temperature except for the alicyclic epoxy compound (A) denoted above; an acid anhydride hardener (C); a hardening accelerator (D); and an inorganic filler (E) where the amount of composition of (A) constituent in 100 pts.mass of a total epoxy resin in the composition is 30-95 pts.mass.SELECTED DRAWING: None