Old Web
English
Sign In
Acemap
>
Paper
>
Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near‐infrared spectra
Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near‐infrared spectra
2020
Jian Yang
Tong Zhang
Yue Yin
Wenhong Jiang
Yunzhe Du
Xiaofei Zhu
Bo Jiang
Yudong Huang
Keywords:
Silicone resin
Materials science
Spectroscopy
near infrared spectra
Composite material
Quantitative analysis (chemistry)
Curing (chemistry)
Correction
Source
Cite
Save
Machine Reading By IdeaReader
35
References
1
Citations
NaN
KQI
[]