Dry etching, dry etching, and used in this case plate

Dry etching with: a chamber (18); a substrate (1), which is arranged inside the chamber (18); and a plate (14) having a plurality of opening portions (15) and is adapted to cover the substrate (1), wherein the plate (14) is arranged such that, while covering the substrate (1), a distance (D) between the substrate (1) opposite surface and the substrate (1) in a peripheral portion is smaller than a distance ( D) between (the substrate 1) opposite surface and the substrate (1) in a central portion, and the plate (14) has a projecting side wall (16) which is arranged along the border of the plate (14), wherein the side wall (16) to an electrode (9) within the chamber (18) or to a substrate carrier (13) is applied, on which the substrate (1) is arranged, so that the residuals, which are generated during etching, in a space between the ...