Bonding strength evaluation of Al foil/AlN junctions by surface activated bonding

An Al foil/AlN junction is fabricated by bonding a 30-μm Al foil and a 650-μm AlN plate at room temperature and 473 K. Their bonding strength, which is measured by the 180° peel test, is estimated to be ~30 and ~60 N/m for junctions fabricated by the room-temperature and 473-K bonding, respectively.