A methodology for RF modeling of packages using IC known-loads
2011
The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.
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