Bubble-free high-speed UV nanoimprint lithography using condensable gas with very low global warming potential

Bubble-free filling needs to be achieved to realize high-throughput mass production in ultraviolet nanoimprint lithography (UV-NIL). Although bubble-free filling can be accomplished by performing UV-NIL under vacuum, nonvacuum processes can lower equipment and operation costs. UV-NIL in 1,1,1,3,3-pentafluoropropane (PFP) has been recognized as a promising method of realizing ultrahigh-speed UV-NIL; however, the global warming potential (GWP) of PFP of 1030 might restrict its industrial use. In this work, UV-NIL of a spin-coated UV-curable resin in trans-1-chloro-3,3,3-trifluoropropene (CTFP), which has a low GWP of <5, was studied with the aim of identifying an alternative to PFP. The cavity filling speed of resin and mold release force in CTFP were comparable to those in PFP, and superior to those in helium atmosphere. Sub-100 nm patterns were successfully fabricated by UV-NIL in CTFP, although the line width shrinkage ratio of patterns fabricated in CTFP was slightly larger than that of patterns fabricated in PFP.