Green mould compounds: Impact on second level interconnect reliability

The change-over from conventional to so-called green moulding compounds has gradually taken place in the last five years. These green mould compound materials have a lower thermal expansion and higher elastic modulus. As a consequence of the modified thermal and mechanical properties, an impact on the thermo-mechanical behaviour of the package-board assembly is expected (so-called Package Board Interaction: PBI). The CTE difference between the package and the board increases introducing the green mould compounds.