Dicing of high-power white LEDs in heat sinks with the water jet-guided laser

High-brightness LEDs are compound semiconductor devices and distinguish themselves from conventional LEDs by their exceptional luminosity. Today they are increasingly used as light sources, replacing conventional incandescent and fluorescent lamp technologies. HB LEDs are difficult to manufacture, as they must be grown by sophisticated epitaxial growth techniques such as MOCVD. They are packaged like power semiconductors, using surface mount technology and thermal pads. After having been successfully applied to GaN scribing for side-emitting LEDs, the Laser MicroJet (R) is used today for cutting heat sinks of HB white LEDs. Due to the high-emitted light power, the generated heat must be dissipated through a heat sink. Materials typically employed are metals with high heat conductivity, notably CuW and molybdenum. Applying the Laser MicroJet (R) the achieved cutting quality in these metals is outstanding - smooth edges, no contamination, no burrs, no heat damage, no warping - all this at high speed.