Research on the Application of InPbAg Solder in Multi-temperature Gradient Soldering

To deal with the problem that the two-temperature gradient cannot meet the requirements for the soldering process of the complex boxes encountered in the micro-assembly soldering process, this paper explains the research on the multi-temperature gradient soldering process of Ro5880 gold-plated substrates on 6063 aluminum alloy gold-plated plates with the InPbAg solder. The process parameters of InPbAg solder were determined by the orthogonal experiment, and the impacts of these parameters on the InPbAg solder were analyzed. The test results show that the void ratio of the soldering surface is less than 5% and the shearing strength is greater than 12N/mm2. The experiment shows that the flux has great impact on the soldering quality of InPbAg solder and therefore needs careful selection; the InPbAg solder can be used as the third temperature solder to meet the requirements of the multi-temperature gradient soldering.