New approaches towards the understanding of the catastrophic optical damage process in in-plane diode lasers

The microscopic processes accompanying the catastrophic optical damage process in semiconductor lasers are discussed. For 808 and 650 nm edge-emitting broad-area devices relevant parameters such as surface recombination velocities, bulk and front facet temperatures are determined and discussed. Facet temperatures vs. laser output and temperature profiles across laser stripes reveal a strong correlation to near-field intensity and degradation signatures. Furthermore, the dynamics of the fast catastrophic optical damage process is analyzed by simultaneous high-speed infrared thermal and optical imaging of the emitter stripe. The process is revealed as fast and spatially confined. It is connected with a pronounced impulsive temperature flash detected by a thermocamera.