Electrodeposition of Cu into a Highly Porous Ni/ YSZ Cermet
2006
The electrochemical deposition of Cu into 0.12 cm and 60 μm thick, highly porous (65 vol %) Ni/yttria-stabilized zirconia (YSZ) cermets was investigated. An electrochemical cell in which the electrolyte solution was allowed to flow through a porous Ni/YSZ substrate was used to eliminate mass-transfer limitations and to determine the conditions for which the potential drop in the electrolyte solution was minimized and a uniform Cu layer was produced throughout the porous substrate. The conditions determined from these experiments were then used to electrodeposit Cu throughout a thin, porous Ni-YSZ cermet anode layer on a solid oxide fuel cell (SOFC) using a standard nonflow-through setup. This SOFC was found to exhibit stable operation while using methane as the fuel.
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