Thermal Analysis of High Power LED Bulb. Comparison between Aluminum, Ceramic and Stainless Steel Package-On-Substrates

Slavka Tzanova,Nikolay Kurtev

Thermal Analysis of High Power LED Bulb. Comparison between Aluminum, Ceramic and Stainless Steel Package-On-Substrates

2019

Slavka Tzanova
Nikolay Kurtev

In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.

Keywords:

Thermal analysis
LED lamp
Metallurgy
Ceramic
Materials science
Aluminium
Composite material
cfd simulation
Bulb
Light-emitting diode
Heat sink

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