Component mounting board inspection method using the inspection method and substrate manufacturing system

In the visual inspection for a printed circuit board mounted with an electronic component, the connection to ensure good printed circuit board and the electronic component. Solder paste appearance inspection apparatus (20) coated with a solder paste (93) is a printed circuit board (91) for visual inspection. An electronic component mounting apparatus (30) the electronic component (92) is mounted on the solder paste coated with (93) a printed circuit board (91). Reflow soldering apparatus (50) of the printed circuit board (91) mounted electronic component (92) of the reflow process. After reflow soldering visual inspection means (60) to be mounted in a reflow process electronic component (92) is a printed circuit board (91) for visual inspection. Here, visual inspection after the reflow soldering apparatus (60) is connected via the personal computer (70) with the solder paste appearance inspection apparatus (20), visual inspection of the solder paste (93) using a solder paste inspection device (20) results , by visual inspection for a printed circuit board (91) mounted electronic component (92) is.