Ultra thinning 300-mm wafer down to 7-µm for 3D wafer Integration on 45-nm node CMOS using strained silicon and Cu/Low-k interconnects

High performance 45-nm Node and its 3D integration employed aggressively thinned down to 7- µm of 300-mm wafer for the Wafer-on-a-Wafer (WOW) application has been succeeded for the first time. The impact of ultra thin wafer on strained transistors and Cu/low-k multilevel interconnects is described. Properties examined include Kelvin and stack chain resistances of Cu interconnects as well as Ion-Ioff, threshold voltage shift, and junction leakage of transistors. It was found that the electrical properties were not affected by bonding, thinning and debonding process indicating good feasibility of 3D stacking integration to the strain and low-k technology.