A process for producing a contact portion of an electronic component

The invention relates to a method of forming at least one local contact region of a substrate of an electrical component for contacting the contact region with a connector, wherein the substrate is provided with a contact side is made of metal or metal-containing porous layer. To provide a mechanically durable electrically properly solderable contact area available, it is suggested that the porous layer is compressed in the contact area to be formed and / or removed.