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Influence of Cleaning and Soft Etching for Electroless Palladium/Gold Plating on Copper Fine Pattern
Influence of Cleaning and Soft Etching for Electroless Palladium/Gold Plating on Copper Fine Pattern
2017
Tomohito Kato
Hajime Terashima
Hideto Watanabe
Mitsuhiro Watanabe
Hideo Honma
Osamu Takai
Keywords:
Metallurgy
Etching
Materials science
Inorganic chemistry
Copper
Palladium
Gold plating
Correction
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