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Flip Chip Wafer Level Packaging of a Flexible Chip Scale Package (CSP)
Flip Chip Wafer Level Packaging of a Flexible Chip Scale Package (CSP)
1999
Gregory B. Hotchkiss
Gonzalo Amador
Darvin R. Edwards
Paul Hundt
Les Stark
Roger J. Stierman
Gail Heinen
Keywords:
Flip chip
Wafer-level packaging
Optoelectronics
Computer science
Chip-scale package
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