Substrate and production method for packaging structure

The invention provides a substrate and a method for manufacturing a package structure using the substrate. The substrate comprises a first surface, a crystal placing area, a cutting route, a plurality of first pads and a first anti-welding layer. The crystal placing area is positioned on the first surface and used to be provided with a chip. The first pads are arranged on the first surface. The first anti-welding layer is arranged on part of the first surface, and exposes part of the cutting route and the plurality of first pads. The first anti-welding layer is approximately cut into a first internal area and a first external area by the cutting route. The crystal placing area and the first pads are positioned in the first internal area, wherein, at least part of the cutting route is connected with the first internal area and the first anti-welding layer of a second external area.