3-DLarge-Scale IC/MEMSCo-Integration UsingLiquid Solder forFlip-Chip Assembly

Inthis paper, we discuss aflip-chip packaging method using liquid solder for3-Dlarge-scale Electronic/MEMS cointegration. Thisapproach hasbeeninspired fromselfassembly technique whichisemerging asoneofthemain methods forfabrication ofheterogeneous micro- andnanosystems. We proposed toformsolder bumpbycoating liquid solder directly onelectrodes ofa MEMS chipbasedon sophisticate microstructures ofelectrostatic microactuator array. Self-alignment andassembly techniques forelectronic receptor chipwerealsodetailed inorder toachieve efficient flip-chip ofMEMS andElectronic chipwithout anystiction andcontamination problem. Functionality ofthesystem has beenvalidated andperspectives discussed.