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OS1806 Effect of Thermal Cyclic Load on Phase Growth in Solder Joint
OS1806 Effect of Thermal Cyclic Load on Phase Growth in Solder Joint
2012
Hiroshi Ohtake
Takao Mori
Toshihiko Sayama
Hiroyuki Tsuritani
Takeshi Takayanagi
Yoshiyuki Okamoto
Keywords:
Thermal
Soldering
Composite material
Materials science
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