High Density Silicon Photonic Integrated Circuits and Photonic Engine for Optical Co-packaged Ethernet Switch

We present performance of 1.6 Tbps silicon photonic integrated circuits (SiPICs) and their key device components. These high bandwidth density SiPICs enabled fully functional photonic engines (PEs) that can be co-packaged with Ethernet switches and demonstrated IEEE standards compliant interop-link with 400 Gbps DR4 modules.