Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings

This study shows a technique to avoid the necessary spray-coating of devices under test with low- emissivity surfaces in failure analyses by pulsed IR thermography. Such samples can be sintered or soldered electronic components. The mentioned technique is based on a vacuum foil lamination process, which does not contaminate the samples and saves the time of sample preparations. For this purpose, a suitable and optimal foil must be found, which was the goal of this study. This enables inline inspections in industrial production lines by non-destructive IR thermography methods and an additional alternative to conventional techniques such as scanning acoustic microscopy and x-ray analyses.