Thin film packaging structure

The invention relates to the field of thin film packaging, in particular to a thin film packaging structure which comprises a thin film packaging layer, a functional device and a micro-nano array film layer. The thin film packaging layer is used for packaging the functional device, the micro-nano array film layer is arranged on the thin film packaging layer. The thin film packaging structure has the advantages that micro-nano array film layer is arranged on the thin film packaging layer, accordingly, the surface strength of the thin film packaging layer can be improved, and the thin film packaging layer can be prevented from being easily abraded and scratched.