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Evaluation of package and PCB effects on RFICs in W-CDMA applications
Evaluation of package and PCB effects on RFICs in W-CDMA applications
2005
Jian-Ming Wu
Fu-Yi Han
T. S. Horng
Cheng-Chia Tu
wujianming
Keywords:
Electronic engineering
Computer science
W-CDMA
Materials science
Correction
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