Packaging adjustment method of LED (light-emitting diode) light source

The invention provides a packaging adjustment method of an LED (light-emitting diode) light source, and belongs to the technical field of a packaging method of an LED. The method comprises the steps of: fixing an LED chip on a substrate; providing a printed circuit layer on the substrate; respectively connecting the cathode of the chip and the cathode of a printed circuit layer of the substrate; connecting the anode of the chip and the anode of the printed circuit layer of the substrate, and then connecting the anode and the cathode of the substrate; preparing mixture of fluorescent powder and silica gel according to the ratio, and coating the mixture of the fluorescent powder and the silica gel on the chip; respectively connecting two poles of direct current power supply on the chip and the back side of the substrate; and putting the light source adjusted to the requirement into an oven to be baked. According to the packaging adjustment method of the LED light source provided by the invention, the fluorescent powder can be more evenly distributed at the required position, and the technical parameters such as color temperature, chromatic coordinate and luminous flux between the finally produced LED light sources are high in consistency, and waste of the fluorescent powder is reduced.