CU, ZN AND CU-ZN ALLOYS ELECTRODEPOSITION FROM IONIC LIQUIDS

Electrodeposited thin films and nanowires of zinc, copper and their alloys were deposited from the ionic liquid 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)im ide. The anion of the metallic salt (Bis(trifluoromethylsulfonyl)imide) was the same as that used as solven t. The electrochemical experiments were performed at room temperature in an argon-filled glove-box with water and oxygen content below 1 ppm. The electrodeposition and the morphology of zinc, copper and their mix ed deposits are reported. The obtained voltammograms are complicated and exhibit several electrodeposition steps (Fig . 1).