A method of manufacturing a heat sink

2009 
A heat sink and a manufacturing method, the heat sink for dissipating heat generated by electronic components, comprising a bottom plate in contact with the electronic component, a plurality of cylindrical heat radiating body, a plurality of circular insertion hole provided on the bottom plate to correspond to the housing the radiator, the radiator includes a heat radiating portion at both ends thereof, and a mounting portion connected to the intermediate cooling portion caulked portion mounting portion, the mounting portion received in an interference fit within the receptacle, the riveting an inner wall portion in close contact with the bottom plate of the jack and an outer diameter smaller than the outer mounting portion, an outer diameter larger than the outer diameter of the heat dissipating portion of the mounting portion. When manufacturing the radiator, the radiator mounting portion is inserted into the interference fit mounting board jack, pressing the tool through the top surface of the base plate at the periphery of each radiating member, the caulked section caulked . Since the interference of the radiator mounting portion of the caulking the caulked portion fit together with the installation of this two-stage cooling body may be positioned well, the radiator firmly incorporated in the base plate.
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