Simulation and experimental study of microwave heating of single lap adhesive-bonded polypropylene joint

Microwave heating of modeled single lap adhesive-bonded polypropylene joint was simulated using a computer program. The modeled joint was heated in an applicator based on a standard rectangular waveguide WR340 operating at 2.45 GHz with TE10 mode. The heating process was represented by a 2-dimensional numerical model developed previously by the authors. The temperature distribution in the adhesive layer and the heating rate of the joint were predicted. The simulated results were validated by experiments. It was found that the simulation gave reasonably accurate prediction of the microwave heating of an adhesive joint. Polym. Eng. Sci. 44:728–735, 2004. © 2004 Society of Plastics Engineers.