Computer Aided Assessment of Reliability Using Finite Element Methods

Abstract : This report documents the development effort of a desk top reference handbook on how to use FEA results to predict electronic device life. The handbook is unique in several areas. Instead of being device oriented, it is oriented toward predicting material life for devices in certain system configurations and environments (i.e., instead of an LCC failure rate calculation, the solder joint fatigue life for an LCC device mounted to a circuit board subjected to a given RMS vibration load will be computed). The handbook contains the most comprehensive material data base available (under one cover) for FEA of electronic devices, and provides step-by-step examples (with number substitutions and units) for every failure mechanism and every material failure algorithm addressable by FEA. The procedures presented in this handbook can be applied to any electronics program to predict the life for electronic devices mounted in high stress areas. Familiarization with FEA procedures is assumed for the user of this handbook; however, guidelines are provided for applying FEA to microscale electronic structures.