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Integration of Low‐k Dielectric Films in Damascene Processes
Integration of Low‐k Dielectric Films in Damascene Processes
2007
R.J.O.M. Hoofman
V.H. Nguyen
V. Arnal
M. Broekaart
L.G. Gosset
W.F.A. Besling
M. Fayolle
Francesca Iacopi
Keywords:
Copper interconnect
Low-k dielectric
Materials science
Electronic engineering
Electrical engineering
Engineering physics
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