Chemical mechanical cleaning for CMP defect reduction

As device geometry shrinks, defect reduction for yield improvement has always been the key focus in CMP process qualification. New post-CMP cleaning capability is demanded for meeting defect reduction requirement. To address the cleaning challenges in advanced nodes, innovation is needed. This paper reviews the innovation of Applied Materials CMP in post-CMP cleaning, from Megasonic cleaning for improving particle removal efficiency, to single wafer IPA vapor dryer for achieving water-mark free drying, and to a unique chemical mechanical cleaning (PreClean) technology for fulfilling the requirement of organic residue, particle, and nano-sized slurry ball removal in sub 10nmand beyond.