Old Web
English
Sign In
Acemap
>
Paper
>
Compact and low‐profile GaN hybrid‐IC based on TSV Si‐interposer technology
Compact and low‐profile GaN hybrid‐IC based on TSV Si‐interposer technology
2017
Jong-Min Yook
Dongsu Kim
Jun-Chul Kim
Keywords:
Electronic engineering
Mathematics
Interposer
Three-dimensional integrated circuit
silicon interposer
Optoelectronics
Correction
Source
Cite
Save
Machine Reading By IdeaReader
2
References
0
Citations
NaN
KQI
[]