Wafer Related Al¶x¶Ga¶y¶In¶z¶N structures

Light-emitting devices having a vertical optical path z. For example, a surface emitting laser comprising a vertical cavity or a light emitting component with or -erfassendes resonant cavity mirrors with high quality can be achieved using wafer bonding or soldering metal. The light emitting region is located between one or two reflector stacks, the dielectric distributed Bragg reflectors (DBRs) included. The dielectric DBR may be deposited or be attached to the light emitting device. A base substrate of GaP, GaAs, InP or Si is mounted on one of the dielectric DBRs. Electrical contacts are added to the light emitting device.