Mounting method and electronic device of the electronic component

The present invention, on the main surface of the wiring board (1) to the connecting terminal and the conductor wires are provided, the solder powder, a resin composition comprising a resin having fluidity at the melting temperature of the convection additive and the solder powder (3 ) a step of applying a plurality of electronic components including at least one passive component (7), (8), (made 9), each electronic component prepared electronic component group having an electrode terminal, the connection terminals and aligning said electrode terminal and a step of abutting the electronic component group in the resin composition surface, and heating at least the resin composition, by the convection additive causes melting the solder powder the solder powder is self-assembled between the electrode terminal and the connecting terminal, a step of connecting solder the connection terminal and the electrode terminal, the electronic component group by curing the resin of the resin composition wherein the respective distribution And a step of bonding and fixing the substrate by the resin, without previously forming bumps makes it possible to greatly simplify the mounting process.