Electroconductive adhesive composition, and electroconductive adhesive film and dicing/die bonding film each obtained using same

Provided are: an electroconductive adhesive composition which is suitable for use as an electroconductive bonding material for bonding, for example, a semiconductor chip (in particular, a power device) to the surface of an element-supporting part of a lead frame or to the surface of a circuit electrode part of an insulating substrate and from which a bonding layer that is lead-free and is excellent especially in terms of both heat resistance after bonding/sintering and mounting reliability can be formed between a semiconductor chip and either the surface of an element-supporting part of a lead frame or a circuit electrode part of an insulating substrate; and an electroconductive adhesive film and a dicing/die bonding film each obtained using the composition. The electroconductive adhesive composition of the present invention comprises metal particles (Q) and a given organophosphorus compound (A), wherein the metal particles (Q) include first metal particles (Q1) constituted of one metal selected from the group consisting of copper, nickel, aluminum, and tin or constituted of an alloy comprising two or more metals selected from said group.