Ball bonding palladium (Pd) coated copper wire

A FAB palladium ball bonding to solve the instability of the molten ball formed by (free air ball) (Pd) to provide a coated copper wire. To A core member made of copper (Cu) or copper alloy coating layer of palladium (Pd) is formed, the wire diameter is in the ball bonding for palladium (Pd) coated copper wire 10 to 25 [mu] m, palladium (Pd ) in the coating layer is present a palladium (Pd) single solid layer, and exudation layer is formed of palladium (copper from the core material on the coating layer of Pd) (Cu), copper (Cu) surface of the exudation layer is oxidized. .FIELD 1