Epoxy resin composition comprising nanopore particles and semiconductor device using the same

The epoxy resin composition and a semiconductor device using the same, including the nano-porous particles are provided. The epoxy resin composition containing the nano-porous particles according to the present invention is an epoxy resin 5 to 60 parts by weight; Nitrile 10 to 60 parts by weight of a butadiene-acryl; Curing agent 2-20 parts by weight; 0.2 to 5 parts by weight of a curing accelerator; Nano-porous ion scavenger 1 to 20 parts by weight; Additives 0.5 to 5 parts by weight; And it characterized in that it comprises an organic solvent from 10 to 50 parts by weight, the epoxy resin composition according to the invention to move between elements of the metal ion, copper, etc., while maintaining excellent adhesion adhesive strength, especially at high temperatures can be effectively suppressed. Thus, a semiconductor device sealed by an epoxy resin composition according to the invention exhibit excellent reliability at high temperatures.