Old Web
English
Sign In
Acemap
>
Paper
>
Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates
Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates
2019
Igor O. Usov
David M. Waschezyn
Douglas R. Vodnik
Robert Ryan Waked
Michael Robert Middlemas
Matthew M. Schneider
Terry G. Holesinger
Keywords:
Microstructure
Adhesion
Materials science
Composite material
Electrical resistance and conductance
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]