Guided terahertz pulsed reflectometry simulation with near field probe

Guided terahertz pulse reflectometry is a failure analysis method applied to detect and locate open circuits or impedance fluctuations in the advanced 3D packages. In this article. We propose use near field microprobe to test some transmission lines and defective circuits in the different level of the packaging. We do some finite element simulations of various types of terahertz waveguides by combining defects with different sizes and positions, in order to predict the different orders of magnitude of the awaited signal after propagation trough several interconnections. We could finally deal with the detectability of several defects by this new technique.