Manufacturing method of photosensitive structure

The invention discloses a manufacturing method of a photosensitive structure. The manufacturing method provided by the invention comprises the following steps of: (a) forming a circuit layer on the upper surface of a first substrate, wherein the first substrate comprises at least one light sensing subassembly and the circuit layer comprises at least one subassembly structure and at least one release characteristic structure; the release characteristic structure is formed by using metal materials and is formed on parts of the light sensing subassembly and the subassembly structure; (b) covering a first light filtering layer on the partial area of the circuit layer; and (c) removing the release characteristic structure with a wet etching process.