An indium phosphide backside via process for microwave and millimeter wave applications

Summary form only given. A backside via process suitable for use on standard monolithic microwave integrated circuit (MMIC) technologies has been developed for indium phosphide based substrate material. A wet etch via process has been developed to allow for the use of standard GaAs type microstrip transmission lines and layout design rules for advanced MMICs. This wet etch process can etch backside vias with bottom dimension as small as 40 mu m in diameter in InP material with the same design rules as conventional GaAs processes. >