Method of manufacturing a solder electrode, a method of manufacturing a laminate, laminate and electronic components

The present invention, the coating provided on a substrate having an electrode pad, by forming an opening in the electrode pad portion corresponding on the substrate, forming a resist from said coating on said substrate (I ), and a method for producing a solder electrode having a step (II) for the molten solder in the openings of the resist, the resist comprises at least two layers comprising a resin as a component, and the said resist closest layer to the substrate (1), the layer components that crosslink by a resin contained as a constituent component heat (1), and by the heat of solder electrodes, characterized in that does not substantially contain a component of self-crosslinking it is a manufacturing method. According to the manufacturing method of the solder electrode of the present invention, even when using a method involving high-temperature treatment, small damage resist is subjected, excellent adhesion between the substrate and the resist, ensures solder electrodes of interest it can be formed on. The method of forming the solder electrode of the present invention can be effectively used such as a bump formation by IMS method.