Strain transfer through film-substrate interface and surface curvature evolution during a tensile test

Abstract Uniaxial tensile tests on polyimide-supported thin metal films are performed to respectively study the macroscopic strain transfer through an interface and the surface curvature evolution. With a dual digital image correlation (DIC) system, the strains of the film and the substrate can be simultaneously measured in situ during the tensile test. For the true strains below 2% (far beyond the films’ elastic limit), a complete longitudinal strain transfer is present irrespective of the film thickness, residual stresses and microstructure. By means of an optical surface profiler, the three-dimensional (3D) topography of film surface can be obtained during straining. As expected, the profile of the specimen center remains almost flat in the tensile direction. Nevertheless, a relatively significant curvature evolution (of the same order with the initial curvature induced by residual stresses) is observed along the transverse direction as a result of a Poisson's ratio mismatch between the film and the substrate. Furthermore, finite element method (FEM) has been performed to simulate the curvature evolution considering the geometric nonlinearity and the perfect strain transfer at the interface, which agrees well with the experimental results.